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Editorial review: From the author of the wildly popular Thieves World and Shadow of the Wolves series comes the second book in the Riftwar saga. In this book, The Prince of the Blood, Feist delves deep into the world of the faerie.In the manufacturing of semiconductors and other devices which include microcircuits, a number of processing steps are utilized. One of the most important steps in these manufacturing processes is the etching of the wafer in certain regions. For example, in the manufacture of microcircuits an insulating layer is applied over the entire wafer, followed by a patterned photoresist, followed by an anisotropic etch through the material of the insulator layer in the region that is protected by the photoresist to form a plurality of narrow raised parallel lines, called trenches. These trenches are used to create connections among the various parts of the electronic device. In an alternate embodiment of this process, the insulator may be applied to the surface of the wafer, and the photoresist may be applied to only part of the wafer. The photoresist is exposed to light, and the unexposed areas are washed away, leaving a desired pattern of raised parallel lines of the photoresist. An anisotropic etch is performed through the material of the insulator layer in the regions not protected by the photoresist. The photoresist and the unwanted material that was not removed by the etch are washed away, and the wafer is bonded to a support wafer.
In forming the trenches, an etching step that is conducted in a corrosive environment is employed. A significant cause of wafer breakage during the etching process is the formation of cracks in the wafer. A wafer will normally contain one or more processing regions in which it is desirable to stop or to terminate the etching process. These regions are called endpoints.
One approach to preventing wafer breakage during the etching process is to place a protector over the wafer during the etching process. For example, when the wafer is being etched with a mixture of a gas and an additive, a protector is typically placed on the wafer. The additive in the gas reacts preferentially with the substrate material at the bottom of the trench, providing a more uniform etch profile and providing a more even spacing of the raised lines of the photoresist, increasing the dimensional accuracy of the trenches.
In forming the protector, a layer of phot